| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 74HC541D | NXP/恩智浦 | SOP20 | 2213+ | 2000 | 2025-12-05 | |||
| OP07CG-D08-T | UTC/友顺 | DIP-8 | 2526+ | 10000 | 2025-08-13 | |||
| 2SB1079 | ISC/无锡固电 | TO-3P | 09+ | 7 | 2025-07-22 | |||
| OPA633KP | BURR-BROWN | DIP | 5 | 2025-07-22 | ||||
| RK14K1240D04 | ALPS/阿尔卑斯 | 800 | 2025-07-22 | |||||
| DS2125-C01/TR | DALLAS SEMICONDUCTOR | QFP48 | 0625+ | 2000 | 2025-07-22 | |||
| OPA2340UA | BURR-BROWN | SOP-8 | 04+ | 84 | 2025-07-22 | |||
| 2SB1079 | ISC/无锡固电 | TO-3P | 0947+ | 7 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 93LC46B-I/P | MICROCHIP/微芯 | DIP-8 | 09+ | 807 | 2025-07-22 | |||
| 93LC46B/P | MICROCHIP/微芯 | DIP8 | 98+ | 20000 | 2025-07-22 | |||
| 93C46BT-I/SN | MICROCHIP/微芯 | SOP | 08+ | 3300 | 2025-07-22 | |||
| 74ALS1034 | NS/美国国半 | SOP14 | 92+ | 1990 | 2025-07-22 | |||
| 48CTQ060PBF | INFINEON/英飞凌 | 10+ | 4800 | 2025-07-22 | ||||
| 2SA1154 | NEC/日电电子 | TO-92L | 04+ | 1990 | 2025-07-22 | |||
| 25LC640-I/P | MICROCHIP/微芯 | DIP-8 | 09+ | 760 | 2025-07-22 | |||
| 25AA256T-I/SM | MICROCHIP/微芯 | SOP-8 | 07+ | 2028 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| OP07CG-D08-T | UTC/友顺 | DIP-8 | 2526+ | 10000 | 2025-08-13 | |||
| PIC24HJ128GP310-I/PF | MICROCHIP/微芯 | TQFP | 06+ | 3 | 2025-07-22 | |||
| PIC24FJ128GA010-I/PF | MICROCHIP/微芯 | QFP | 07+ | 3 | 2025-07-22 | |||
| PIC18F6490-I/PT | MICROCHIP/微芯 | TQFP | 07+ | 5 | 2025-07-22 | |||
| PIC18LF4585-I/PT | MICROCHIP/微芯 | TQFP | 07+ | 144 | 2025-07-22 | |||
| PIC18F8720-I/PT | MICROCHIP/微芯 | TQFP | 07+ | 88 | 2025-07-22 | |||
| PIC24FJ128GA006-I/PT | MICROCHIP/微芯 | TQFP | 06+ | 3 | 2025-07-22 | |||
| PIC18F97J60-I/PT | MICROCHIP/微芯 | TQFP | 07+ | 3 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC18LF452-I/PT | MICROCHIP/微芯 | TQFP | 08+ | 23 | 2025-07-22 | |||
| CY8CPLC10-28PVXI | CYPRESS/赛普拉斯 | 20-SSOP | 08+ | 282 | 2025-07-22 | |||
| PCA9509D | NXP/恩智浦 | SOIC-8 | 08+ | 100 | 2025-07-22 | |||
| M30620FCPFP | RENESAS/瑞萨 | QFP-100 | 08+ | 232 | 2025-07-22 | |||
| PIC10F222T-E/OT | MICROCHIP/微芯 | SOT-23 | 1205+ | 1994 | 2025-07-22 | |||
| PIC16F627A-I/P | MICREL/麦瑞 | DIP | 0817 | 100 | 2025-07-22 | |||
| PIC16F73-I/SS | MICROCHIP/微芯 | SSOP | 08+ | 3 | 2025-07-22 | |||
| PIC18F2220-I/SP | MICROCHIP/微芯 | DIP | 0707+ | 5 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DS3232MZ+TRL | MAXIM/美信 | SOP8 | 1631+ | 1573 | 2025-07-22 | |||
| P89LPC903FD | NXP/恩智浦 | SOIC-8 | 08+ | 4437 | 2025-07-22 | |||
| EP320PC | ALTERA/阿尔特拉 | DIP | 99+ | 1494 | 2025-07-22 | |||
| AT89C51RC2-SLSUM | ATMEL/爱特梅尔 | PLCC-44 | 0926+ | 199 | 2025-07-22 | |||
| S29GL256P11TFI020 | SPANSION/飞索半导体 | 48TSSOP | 1018+ | 91 | 2025-07-22 | |||
| MC10H101L | MOTOROLA/摩托罗拉 | CDIP-16 | 9112+ | 100 | 2025-07-22 | |||
| DG211CJ | SILICON/芯科 | DIP-16 | 8952+ | 20 | 2025-07-22 | |||
| ADC0841CCN | NS/美国国半 | DIP-20 | 07+ | 150 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| OPA633KP | BURR-BROWN | DIP | 5 | 2025-07-22 | ||||
| OPA2340UA | BURR-BROWN | SOP-8 | 04+ | 84 | 2025-07-22 | |||
| TLC27M4IPWR | TI/德州仪器 | TSSOP-14 | 0819+5 | 2000 | 2025-07-22 | |||
| TLC27M4IPW | TI/德州仪器 | TSSOP-14 | 0819+5 | 2000 | 2025-07-22 | |||
| TLC27M2CDR | TI/德州仪器 | SOP-8 | 17+ | 25000 | 2025-07-22 | |||
| INA114AP | BURR-BROWN | DIP8 | 2113+ | 200 | 2025-07-22 | |||
| TLC27M4CN | TI/德州仪器 | DIP-14 | 9040+ | 10000 | 2025-07-22 | |||
| LF247DT | ST/意法 | SOP-14 | 09+ | 10 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SN74LS541DW | ONSEMI/安森美 | SOP | 00+ | 2010 | 2025-07-22 | |||
| MC14584BCP | MOTOROLA/摩托罗拉 | DIP-14 | 9136+ | 265 | 2025-07-22 | |||
| SN74LS04N | TI/德州仪器 | DIP-14 | 16+ | 16 | 2025-07-22 | |||
| P80C31SBAA | NXP/恩智浦 | PLCC44 | 1311+ | 439 | 2025-07-22 | |||
| 74LVC541AD | PHILIPS/飞利浦 | SOP-20 | 0022+ | 4000 | 2025-07-22 | |||
| MC74LVX132DR2G | ONSEMI/安森美 | SOP-14 | 09+ | 20000 | 2025-07-22 | |||
| CD74HCT534E | HARRIS/哈里斯 | DIP-20 | 96+ | 617 | 2025-07-22 | |||
| SN74LS125AN | MOTOROLA/摩托罗拉 | DIP-14 | 9311+ | 10 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LM96080CIMTX/NOPB | NS/美国国半 | TSSOP-24 | 14+ | 1500 | 2025-07-22 | |||
| UC3842BD1 | ST/意法 | SOIC-8 | 01+ | 375000 | 2025-07-22 | |||
| MIC5209-3.3YM | MICROCHIP/微芯 | SOP-8 | 0415+ | 82 | 2025-07-22 | |||
| KA7815ETU | FAIRCHILD/仙童 | TO220 | 17+ | 100 | 2025-07-22 | |||
| KA7815 | FAIRCHILD/仙童 | TO220 | 17+ | 100 | 2025-07-22 | |||
| 25AA256-I/P | MICROCHIP/微芯 | DIP | 0529 | 15 | 2025-07-22 | |||
| LA7835 | SANYO/三洋 | DIP | 50 | 2025-07-22 | ||||
| LNK304PN | POWER INTEGRATIONS/帕沃英蒂格盛 | DIP-8 | 10+ | 870 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DSPIC33FJ256GP710-I/PF | MICROCHIP/微芯 | QFP | 06+ | 3 | 2025-07-22 | |||
| BA00BCOWFP-E2 | ROHM/罗姆 | TO-252 | 0542+ | 8000 | 2025-07-22 | |||
| PIC16F716-I/P | MICROCHIP/微芯 | DIP | 08+ | 80 | 2025-07-22 | |||
| PIC16F77-I/P | MICROCHIP/微芯 | DIP | 05+ | 10 | 2025-07-22 | |||
| PIC16F819-I/P | MICROCHIP/微芯 | DIP | 08+ | 119 | 2025-07-22 | |||
| PIC16F874A-I/PT | MICROCHIP/微芯 | TQFP-44 | 0643 | 5 | 2025-07-22 | |||
| PIC18F4523-I/PT | MICROCHIP/微芯 | TQFP | 07+ | 1 | 2025-07-22 | |||
| PIC24FJ32GA004-I/PT | MICROCHIP/微芯 | TQFP-44 | 08+ | 20 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| HTB100-P | LEM/莱姆 | Module | 2422+ | 500 | 2025-12-09 | |||
| ADS7809U | BURR-BROWN | SOP | 07/08+ | 150 | 2025-07-22 | |||
| AZ1084S-3.3TRE1 | BCD | 08+ | 8500 | 2025-07-22 | ||||
| AZ1117D-1.5TRE1 | BCD | 08+ | 8500 | 2025-07-22 | ||||
| AZ1117D-5.0TRE1 | BCD | 08+ | 8500 | 2025-07-22 | ||||
| AZ1117H-1.8TRE1 | BCD | 08+ | 8500 | 2025-07-22 | ||||
| AZ1117H-5.0TRE1 | BCD | 08+ | 8500 | 2025-07-22 | ||||
| AZ7500BMTR-E1 | BCD | 08+ | 8500 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| IS42S16100C1-7TL | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS62WV12816BLL-55BLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| 74HC240 | TI/德州仪器 | DIP | 08+ | 2000 | 2025-07-22 | |||
| 7407 | TI/德州仪器 | DIP | 500 | 2025-07-22 | ||||
| 2SK214 | HITACHI/日立 | TO-220 | 08+ | 40 | 2025-07-22 | |||
| 2SK1302 | HITACHI/日立 | TO-220 | 08+ | 1000 | 2025-07-22 | |||
| 2SC3320 | FUJITSU/富士通 | TO-3P | 08+ | 800 | 2025-07-22 | |||
| 2SC2229 | TOSHIBA/东芝 | TO-92 | 08+ | 2000 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| IS42S16400d-7TL | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61LV5128AL-10TLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61LV5128AL-10TLI | ISSI/芯成 | TSOP | 08+ | 650 | 2025-07-22 | |||
| IS61LV25616AL-10TL | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61LV25616AL-10TLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61C6416AL-12TLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61C256AL-12TLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS63LV1024L-10TL | ISSI/芯成 | 08+ | 8500 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| EK-U1-KCU116-G | XILINX/赛灵思 | SMD | 2228+ | 3 | 2025-07-22 | |||
| EK-U1-VCU118-G | XILINX/赛灵思 | SMD | 2228+ | 2 | 2025-07-22 | |||
| EK-U1-ZCU104-G | XILINX/赛灵思 | SMD | 2228+ | 10 | 2025-07-22 | |||
| EK-Z7-ZC706-G | XILINX/赛灵思 | SMD | 2228+ | 42 | 2025-07-22 | |||
| HW-SMARTLYNQ-G | XILINX/赛灵思 | SMD | 2228+ | 1 | 2025-07-22 | |||
| XAZU2EG-1SFVA625Q | XILINX/赛灵思 | SMD | 2228+ | 71000 | 2025-07-22 | |||
| XC7S50-2FTGB196I | XILINX/赛灵思 | SMD | 2228+ | 30 | 2025-07-22 | |||
| XC7S75-2FGGA484C | XILINX/赛灵思 | SMD | 2228+ | 12732 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| NCL2801CFADR2G | ONSEMI/安森美 | SOIC-8 | 2228+ | 2500 | 2025-07-22 | |||
| MP2359DJ-LF-Z | MPS/美国芯源 | TSOT-23-6 | 2228+ | 3000 | 2025-07-22 | |||
| NCP1622BCCSNT1G | ONSEMI/安森美 | TSOP-6 | 2228+ | 3000 | 2025-07-22 | |||
| LNK305GN-TL | POWER INTEGRATIONS/帕沃英蒂格盛 | SMD8 | 2228+ | 2000 | 2025-07-22 | |||
| NCP1654BD65R2G | ONSEMI/安森美 | SOIC8 | 2228+ | 2500 | 2025-07-22 | |||
| LP2950CDT-3.3G | ONSEMI/安森美 | TO-252-3 | 2228+ | 9600 | 2025-07-22 | |||
| MP2105DJ-LF-Z | MPS/美国芯源 | SOT-23-5 | 2228+ | 6000 | 2025-07-22 | |||
| LM317LD13TR | ST/意法 | SOIC-8 | 2228+ | 40000 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| IS42S16400B-7TL | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61C1024AL-12JLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61C1024AL-12TLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61LV6416-10TL | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61LV6416-10TLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61LV5128AL-10TI | ISSI/芯成 | SOP | 08+ | 500 | 2025-07-22 | |||
| IS61LPS12836A-200TQLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 | ||||
| IS61LPS25636A-200TQLI | ISSI/芯成 | 08+ | 8500 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 74HC164D,653 | NEXPERIA/安世 | SOIC-14 | 2228+ | 822500 | 2025-07-22 | |||
| MC74HC08ADTR2G | ONSEMI/安森美 | TSSOP-14 | 2228+ | 2500 | 2025-07-22 | |||
| EK-U1-KCU105-G | XILINX/赛灵思 | SMD | 2228+ | 7 | 2025-07-22 | |||
| XC3S200A-4VQG100C | XILINX/赛灵思 | SMD | 2228+ | 16650 | 2025-07-22 | |||
| XC7A50T-1CSG324I | XILINX/赛灵思 | SMD | 2228+ | 10710 | 2025-07-22 | |||
| XC7A50T-2FGG484C | XILINX/赛灵思 | SMD | 2228+ | 5050 | 2025-07-22 | |||
| XCZU2EG-1SFVC784E | XILINX/赛灵思 | SMD | 2228+ | 1394 | 2025-07-22 | |||
| NC7SZ157P6X | ONSEMI/安森美 | SC-70-6 | 2228+ | 15000 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TPSE476K035R0200 | KYOCERA/京瓷 | ECase | 2228+ | 5200 | 2025-07-22 | |||
| TAJB107K006RNJ | KYOCERA/京瓷 | BCase | 2228+ | 54000 | 2025-07-22 | |||
| TAJD476K016RNJ | KYOCERA/京瓷 | DCase | 2228+ | 20500 | 2025-07-22 | |||
| TAJE227K016RNJ | KYOCERA/京瓷 | ECase | 2228+ | 4800 | 2025-07-22 | |||
| TPSC107K010R0075 | KYOCERA/京瓷 | CCase | 2228+ | 8000 | 2025-07-22 | |||
| TAP156K016CCS | KYOCERA/京瓷 | DIP | 2228+ | 7000 | 2025-07-22 | |||
| TAJA476K006RNJ | KYOCERA/京瓷 | ACase | 2228+ | 16000 | 2025-07-22 | |||
| TAJA475K016RNJ | KYOCERA/京瓷 | ACase | 2228+ | 14000 | 2025-07-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RNE1C101MDS1PX | NICHICON/尼吉康 | DIP | 2228+ | 4000 | 2025-07-22 | |||
| EEE-FT1V561AP | PANASONIC/松下 | SMD | 2228+ | 1500 | 2025-07-22 | |||
| EEE-FT1C101AR | PANASONIC/松下 | SMD | 2228+ | 4000 | 2025-07-22 | |||
| EEU-FM0J102 | PANASONIC/松下 | DIP | 2228+ | 4000 | 2025-07-22 | |||
| 16SVP39M | PANASONIC/松下 | SMD | 2228+ | 2000 | 2025-07-22 | |||
| EEE-0JA221WP | PANASONIC/松下 | SMD | 2228+ | 5000 | 2025-07-22 | |||
| EEU-FR1C471B | PANASONIC/松下 | DIP | 2228+ | 4000 | 2025-07-22 | |||
| EEU-ED2D331 | PANASONIC/松下 | DIP | 2228+ | 200 | 2025-07-22 |